Thermal management of electronics

Space conditions - without convection-aided cooling - require a well-thought thermal design for the electronic components.

• Thermal analysis of electronics boxes, PCBs and components with varying complexity.
• Temperature mapping on electronics board and components' cases and chips.
• Consideration for temperature- dependent and anisotropic properties.

Thermal test support

• Modelling of ground support equipment, including solar simulator and vacuum chamber.
• Used both for pre-test predictions and thermal model correlation.
• Modelling of liquid-cooled systems and ambient pressure tests.

Orbital analysis

• Accurate determination of orbital heat loads due to solar irradiation, outgoing planet infrared and atmospheric effects.
• Assessment of impact and selection of worst-case scenarios.

Other numerical simulations

• Modelling of exact geometry and raytracing capturing straylight effects.
• Assessment of thermal gradients and thermal stability on complex parts.
• Simulation of honeycomb and other composites.
• Evaluation of RF heating effects.